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C-TECH晶振解答你关于SAW滤波器的十万个为什么
C-TECH是一家领先的制造和开发公司，自1997年成立以来，主要研发生产销售SAW滤波器业务，至今已超过20年。C-TECH采用优异的原料，先进的技术设备生产，产品品质和经验丝毫不输同行。C-TECH晶振正在开发一种半导体工艺，可以独立完成制造和组装。凭借积累的技术和知识，我们提供定制开发根据客户要求的规格。
基于ISO 9001和ISO 14001的可靠性，声表面波滤波器开发和生产本身就是生产CDMA / LTE / 5G移动中继、国防工业、基站、收音机、无线寻呼机、无线麦克风、调频、DMB、GPS、WiFi、高通、蓝牙、IOT等正在被应用到无线业务的各个领域。下面C-TECH对自己精心钻研的产品SAW FILTER声表面滤波器进行详细介绍。
声表面波滤波器（表面声波）是使用表面声波控制信号频率分量和相位分量，以消除相邻信道信号，它是一个带通滤波器（BPF），对接收信道信号进行整形。
SAW滤波器的工作原理
当梳状电极(IDT)形成在压电基板的两侧并且电信号施加到输入端时，沿衬底表面传播的表面声波(SAW)由压电效应产生，并在输出端转换回电信号。这些SAW器件的频率特性由IDT电极的几何结构决定。
SAW滤波器制造工艺
| Process | Equipment | Description |
|---|---|---|
| WAFER Cleaning | Wet Station Rinse & Drier | Process to remove foreign substances causing short circuit defects on the wafer surface before AI deposition and to increase adhesion between the wafer surface and AL |
| Sputtering | Sputter T/Profiler | Process for depositing AL on wafer surface to desired height |
| P.R Coating | Coater | Process for applying photo Resist on AL |
| Exposing | Aligner Stepper | First step process of pattern formation by irradiating UV on PR through MASK |
| Developing | Developer Scope | Process of removing UV irradiated PR for AL Etching after Exposing |
| Etching | Wet Station Rinse & Drier | Process of implementing the final pattern by removing the AL in each selected manner |
| Stripping | Wet Station Rinse & Drier | Process for removing PR that protects AL patterns |
| Auto Probing | Auto Prober Dry Oven | Process for determining good and bad products by measuring metod before puttiong the products divided into cells of the wafer into assembly |
Assembl
| Process | Equipment | Description |
|---|---|---|
| Absorber Coating | Screen Printer Dry Oven | Process of applying an absorber to each cell to improve the characteristics of the output to the measuring device |
| Dicing | Tape Mounter Dicing SAW Cleaner | Process of cutting each cell of the wafer based on the Dicing Line |
| Die Bonding | Die bonder Epoxy Dispenser UV,Dry Oven | Process of bonding base and chip by applying epoxy |
| Wire Bonding | Wire Bonder | The Process of connecting the terminal of the BASE and the PAD of the CHIP to transmit an electrical signal to the AL wire |
| Can Sealing | Spot Welder Seam Sealer Dry Oven | Welding Process using Lid & Cap to protect the chip |
| Marking | Laser Maker | Process of laser marking the product’s unique model name and data code |
| Testing | Network Analyzer | Process for final inspection of product defects |
| Q.C | Network Analyzer | Process of sampling and inspection of mixed or defective products |
| Packing | Tape & Reel | Q.C process for packaging completed products |
| Shipping | Shipment of all process and packaged products |
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